Materials Science & Engineering Science返回 Back

Materials Science:
Surface analysis and analysis of inorganic and organic materials

Engineering Science: Outsourced testing and failure analysis services to semiconductor companies



LOD,SAMPLING SIZE AND ANALYTICAL INFORMARION

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Comparing Analytical Techniques


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EQUIPMENT:

AES

Auger Electron Spectroscopy

 

Raman

Raman Spectroscopy

 

EBIC

Electron Beam Induced Current

 

RBS

Rutherford Backscattering Spectroscopy

 

EBSD

Electron Backscattered Diffraction

 

SEM

Scanning Electron Microscopy

 

EDS

Energy Dispersive X-Ray   Spectroscopy

 

SIMS

Secondary Ion Mass Spectrometry

 

FIB

Focused Ion Beam (Single and dual

Beam Imaging)

 

SPM

Scanning Probe Microscopy

 

FTIR

Fourier Transform Infrared Spectroscopy

 

AFM

Atomic Force Microscopy

 

GC-MS

Gas Chromatography Mass

Spectrometry

 

TEM

Transmission Electron Microscopy

 

GDMS

Glow Discharge Mass

Spectrometry

 

STEM

Scanning Transmission Electron Microscopy

 

HFS

Hydrogen Forward Spectrometry

 

TGA-IR/MS

Thermogravimetric Analysis – Infrared

Spectroscopy/Mass Spectroscopy

 

ICP-OES

Inductively Coupled Plasma Optical

Emission Spectroscopy

 

DTA

Differential Thermal Analysis

 

ICP-MS

Inductively Coupled Plasma Mass

Spectrometry

 

DSC

Differential Scanning Calorimetry

 

IGA

Instrumental Gas Analysis

 

TOF-SIMS

Time of Flight Secondary Ion Mass

Spectrometry

 

LA-ICP-MS

Laser Ablation Inductively Coupled

Plasma Mass Spectrometry

 

TXRF

Total Reflection X-Ray Fluorescence

Spectroscopy

 

LEXES

Low Energy X-Ray Emission

Spectroscopy

 

XPS/ESCA

Spectroscopy for  Chemical Analysis

 

NRA

Nuclear Reaction Analysis

 

XRD

X-Ray Diffraction

 

OP

Optical Profilometry

 

XRF

X-Ray Fluorescence

 

PIXE

Particle Induced X-Ray Emission

 

XRR

X-Ray Reflectivity

 





    

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